EQUIPMENT
Precise Bond line Control & Placement
Datacon APM Chip Bonder
Palomar 3500II Multi Chip Bonder
MRSI 705 Placement System
MRSI 175 Dispensing System
Place Accuracy 5 Micron, 3 Sigma
Laser Height Mapping Of Substrate
Bond Force
Control
Control
Stepper Rotary Dispenser
Machine
Vision
Vision
Interconnection Facility
H&K BJ820 Wedge Bonder
Royce 580 Bond Tester
K&S 8028 Ball Bonder
F&K Delvotec 6220 Ball Bonder
Au & Al Wedge or Ball Bonding
Safety Bonding Applicable
Wire-Pull
Test
Test
Die Shear
Test
Test
SPC
implement
implement
Welding & Leak Test Process
Miyachi LW50/300 Laser Welder
Weldlogic 6100 Micro TIG
DLAS Laser Plastic Welder
Inficon Modul 1000 He Leak Tester
Hermetic Seal Welding
Vacuum Reflow
He & Pressure Decay Leak Test
SS Isolated Package
Custom welding
In-House Sensor Assembly
Programmable Calibration & Temperature Compensation
Atmosphere Control Material Storage
Class 10K Assembly Floor
